Secretary for Innovation & Technology Nicholas Yang attended the Hong Kong Science Park Expansion Programme Ground Breaking Ceremony today.
Speaking to reporters after the event, Mr Yang said the park's gross floor area will be expanded by 20%.
He said he hopes the move will attract quality technology firms to set up business in Hong Kong.
The Innovation & Technology Bureau has launched the $500 million Technology Voucher Programme to help small-and-medium enterprises invest in innovation and technology to improve their productivity and long-term competitiveness, he added.
